ASIC Header – XDIGIT

ASIC design house: Custom analog,
digital, and mixed-signal
integrated circuits

ASIC Definition – XDIGIT
Our Core Expertise

The ASIC: Beyond the component, your strategic advantage

An ASIC (Application-Specific Integrated Circuit) is not just an electronic chip. It is the physical embodiment of your expertise. Unlike standard components, it is designed specifically to meet your unique performance, power consumption, and form factor requirements.

  • IP Protection: Your innovation is etched into silicon, making it extremely difficult to reverse-engineer or copy.
  • Power Optimization: Consume only what is strictly necessary for your specific application.
  • Cost Reduction: Integrate multiple functions (BOM consolidation) into a single chip for industrial volumes.
“We transform the complexity of microelectronic design into a simple and accessible growth lever for our clients.”
Xdigit ASIC Design
ASIC Motivations – Central Architecture

Key motivations for switching to custom design

🚀

Performance & Differentiation

Create a unique product. ASIC allows the integration of specific features that are unavailable off-the-shelf.

Energy Efficiency

Optimize consumption down to the last µW. Ideal for IoT and battery-powered devices.

Xdigit ASIC Design
🛡️

Sovereignty & Security

Protect your IP against copying and secure your supply chain within Europe.

📉

Cost & Size Reduction

Replace multiple components with a single chip. Reduce PCB size and Bill of Materials (BOM) costs.

ASIC Process – XDIGIT

Global Partnership Process

A structured methodology to de-risk your project, from initial concept to mass production.

01
Awareness

Opportunity & Feasibility

Needs analysis and diagnostics: Is an ASIC relevant for you? We identify technical hurdles and guide you toward appropriate funding opportunities.

02
Design

ASIC Development

Detailed specifications, architecture, analog/digital design, and pre-silicon verification performed by our Xdigit experts.

03
Prototyping

MPW Manufacturing

Access to pilot lines and Multi-Project Wafer (MPW) runs via ASTEERICS to validate early prototypes with shared manufacturing costs.

04
Production

Industrialization

Testing, packaging (OSAT), and volume scaling toward mass production with European partner foundries.

Suppliers: Atmel; Global Foundries, SMIC, ST Microelectronics, TSMC, UMC
technological nodes! from 22nm to 350nm.
Skills Portfolio – XDIGIT

Skills Portfolio

Comprehensive technical expertise covering the entire ASIC value chain.

Power Management

DCDC (Buck, Boost) PMU LDO & Shunt Regulators Bandgap / Bias POR / POC

📡 Frequency & Clocking

PLL (CP-PLL, APLL, DPLL) Oscillators (VFO, VCO) Clock Recovery TRNG

🔄 Converters & IO

DAC/ADC (Sigma Delta, SAR, Pipeline) GPIO / SWPIO I2CIO USB2.0 Transceiver

🔒 Security & Monitoring

Glitch Attack Detector Laser Attack Sensor Frequency/Temp Monitoring

Microcontrollers & ARM

STM32 PIC ARM Integration CameraLink CoaXpress

FPGA

Multi-vendor expertise

AMD (Xilinx) Intel (Altera) Lattice Microchip

Digital Interfaces

SWP I2C USB GP

RF Transceivers

NFC 13.56 MHz ISO 14443 / 15693 / 18000-6C RFID / EMV LNA / PA / Mixers

Memory & Sensors

Flash / EEPROM MRAM / SRAM Charge Pump Sense Amplifier IR Image Sensor

High Speed IO

Rapid IO LVDS SERDES

Design & Layout

Schematic Design Layout Design AMS PnR & IO Ring

Simulation & Analysis

Post Layout Extraction IR Drop Analysis Momentum / EMX ADS

IC Test

Test Board Design ATE Programs DFT (Design For Testability) Test Bench & SoC Verification

Analysis & Yield

Yield Analysis Failure Analysis Micro Probing FIB Requests Cost Optimization

Industrialization

Product Engineering & Supply Chain

Foundry Management High-Volume Transition OSAT Management Image Sensors Indus.
Contact CTA – Expertise Style

Let’s discuss it

Contact us today to define the scope of your project together.

Contact Us
ASIC Header – XDIGIT

With Xdigit, bring your ambitions to life
with our custom-made and
high-performance solutions

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